Group 89--Quantum Information and Integrated Nanosystems GroupThe Quantum Information and Integrated Nanosystems Group conducts quantum information science research from a shared foundation of innovative control-signal design, outstanding fabrication tools, and well-equipped measurement infrastructure. The group has a broad range of experimental and prototyping activities. The group's quantum information science activities include the development of superconducting and trapped-ion qubits and quantum sensing with nitrogen-vacancy (NV) centers in diamond. In addition, the group has robust capabilities in classical superconducting circuits, complementary metal-oxide semiconductor (CMOS) design and fabrication, and integrated photonics. These component technologies are used in synergy with quantum information science demonstrations, as well as in standalone applications that include beyond-CMOS circuit technologies, energy-starved sensors, compact optical communication and laser radar transceivers, and microwave photonic signal processing.The Quantum Information and Integrated Nanosystems Group is seeking an integrated photonics development engineer with experience in the simulation, design, layout, fabrication, packaging, and characterization of photonic integrated circuits (PICs). PIC platforms under development include silicon-based (e.g., silicon and silicon-nitride waveguides), compound-semiconductor (e.g., InP, GaAs, GaN and their associated ternary and quaternary compositions), and hybrid. Example PICs include high-speed digital optical interconnects, photonic interfaces to atomic systems for quantum computing and atomic clocks, optomechanical sensors, and microwave photonic signal processors. The candidate will work closely with other Staff to develop advanced components, circuits, and subsystems, and to apply them to solve problems in the national interest. Requirements:BS or MS degree in Electrical Engineering, Chemical Engineering, Materials Science and Engineering, Physics, Chemistry or related field with 3 or more years?? experience in design, fabrication, and/or characterization of optoelectronic components and photonic integrated circuitsMust have experience in the use of and interfacing to wafer-scale electronic or photonic fabrication facilitiesMust exhibit a strong understanding of the interplay between material properties, fabrication processes, and device performance.Experience with photonic simulation tools (e.g., mode solvers, FDTD, beam propagation) and electronic-photonic design and layout tools is desirable.Knowledge of electronic-photonic fabrication processes (e.g., lithography, deposition, etching) is desirable.Knowledge of chemistry, electrical and optical characterization techniques, and advanced packaging techniques is desirableCandidate must have excellent documentation and communication skills, and be able to work both independently and in a dynamic multi-discipline team environment.MIT Lincoln Laboratory is an Equal Employment Opportunity (EEO) employer. All qualified applicants will receive consideration for employment and will not be discriminated against on the basis of race, color, religion, sex, sexual orientation, gender identity, national origin, age, veteran status, disability status, or genetic information; U.S. citizenship is required.
Associated topics: asic, c++, circuit, mems, pcb, soc, solder joint, submicron, transistor, vlsi
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